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Features
CHIPSET
Intel® ICH8M
CPU
Intel® Atom™ N455
MEMORY
1 DDR3 SODIMM up to 2GB
EXPANSION
5 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
3 SATA 2.0
8-bit DIO
LAN
1 Gigabit LAN interface
DIMENSIONS
95mm x 95mm (3.74" x 3.74")
| CHIPSET | Intel® ICH8M |
| CPU | Intel® Atom™ N455 |
| MEMORY | 1 DDR3 SODIMM up to 2GB |
| EXPANSION | 5 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE 1 VGA, 1 LVDS 8 USB 2.0 3 SATA 2.0 8-bit DIO |
| LAN | 1 Gigabit LAN interface |
| DIMENSIONS | 95mm x 95mm (3.74" x 3.74") |
Specifications
PROCESSOR
- • Intel® Atom™ N455
• Single core CPU
• Cooling option: heat sink (fanless solution)
CHIPSET
- • Intel® ICH8M I/O Controller Hub
SYSTEM MEMORY
- • One 204-pin DDR3 SODIMM socket
• Supports DDR3 667MHz only
• Supports up to 2GB system memory
ONBOARD GRAPHICS FEATURES
- • Intel® GMA 3150
- Contains a refresh of the 3rd generation graphics core
• 200MHz render clock frequency
• Supports VGA display
- Resolution up to 1400x1050
• Supports LVDS display
- Resolution up to 1366x768, 18bpp, single channel
• DirectX 9 compliant Pixel Shader 2.0
ONBOARD AUDIO FEATURES
- • Supports AC'97/High Definition Audio interface
ONBOARD LAN FEATURES
- • Intel® 82567V Gigabit Ethernet Phy
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) compliant
SERIAL ATA (SATA) INTERFACE
- • Supports 3 Serial ATA interfaces compliant with SATA 1.0 specification
• SATA speed up to 3Gb/s (SATA 2.0)
IDE INTERFACE
- • Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
CONNECTORS
- • COM Express connectors
- Two 220-pin COM Express 1.0 Type II connectors
- Module connector pin: Tyco 4H3-1827231-6
ENERGY EFFICIENT DESIGN
- • Supports ACPI 2.0/1.0 specification
• Enhanced Intel® SpeedStep Technology
EXPANSION INTERFACES
- • Supports LPC (Low Pin Count) interface
• Supports SMBus interface
• Supports 8 USB 2.0 interfaces
• Supports 5 PCIe x1 interfaces
• Supports 8-bit Digital I/O interface
• Supports 4 PCI interfaces (PCI 2.3 interface)
BIOS
- • Award BIOS
- 8Mbit SPI BIOS
TEMPERATURE
- • 0oC to 60oC
HUMIDITY
- • 10% to 90%
POWER
- • Input: 12V, 5VSB (optional), VCC_RTC
POWER CONSUMPTION
- • 18.95 W with D525 at 1.80GHz and 1x 1GB DDR3 SODIMM
PCB
- • Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R1.0, Type 2
CERTIFICATIONS
- • CE
• FCC Class B
• UL
• RoHS
PACKING LIST
- • 1 LR905-B18M board
• 1 QR (Quick Reference)
• 1 Drivers/utilities disk
Optional Items
- • COM630-B carrier board kit
• Cable kit for carrier board
• Heat sink with fan: A71-111003-000G
• Heat sink: A71-111004-000G

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